| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for securing a semiconductor wafer without using adhesive, dicing the wafer into IC chips and then picking up the IC chip. SOLUTION: The method for dicing a semiconductor wafer comprises step (1) for placing the semiconductor wafer on a dicing table which can be vacuum sacked through a porous film, step (2) for securing the semiconductor wafer to the porous film by vacuum sucking it from the dicing table which can be vacuum sacked, step (3) for dicing the semiconductor wafer secured to the porous film, step (4) for choking the hole in the surface of the porous film not touching the semiconductor wafer while performing vacuum suction and bringing the hole into pressure reduced state, step (5) for carrying the porous film while securing the IC chip thereto, step (6) for bringing the hole of the porous film into normal pressure state, and step (7) for picking up the IC chip and stripping it from the porous film. COPYRIGHT: (C)2007,JPO&INPIT |
