| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminate which is excellent in heat resistance, flame retardancy, dimensional stability and the like and permits high-density assembly, and has outstanding adhesiveness and adhesivity holding power. SOLUTION: The copper-clad laminate comprises an insulating layer on a copper foil, wherein the surface of the copper foil which touches the insulating layer has Rz=0.3-1.0μm, a metal precipitation processing is performed in which metals are deposited so that the metallic elements of the surface of the copper foil measured by a radio-frequency wave inductively coupled plasma (ICP) optical emission spectrometry have nickel of 1-15μg/cm<SP>2</SP>, zinc of 0.1-10μg/cm<SP>2</SP>, and cobalt of 1.5-30μg/cm<SP>2</SP>, and so that cobalt/(nickel+zinc+cobalt) showing the rate of content of cobalt may becomes 0.4 or more, and the processing by a coupling agent is performed, and wherein the insulating layer comprises an aromatic polyimide-based resin having a methyl group equivalent of 205-390 which is obtained by polymerizing monomers wherein at least one of a diamine and an acid anhydride has a methyl group. COPYRIGHT: (C)2007,JPO&INPIT |
