发明名称 METHOD OF HEATING AND COOLING COLOR FILTER SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of heating and cooling a color filter substrate which does not cause cracking on transparent conductive film of a part of color filter substrate corresponding to opening of a hot plate or a cool plate, and coated film on the transparent conductive film. <P>SOLUTION: (1) For heating by means of a hot plate, when a lift pin is lowered, a color filter substrate is placed on the hot plate and is sucked and the head part of the lift pin is located on a position lower than the upper surface of the hot plate, air sucking is started such that the color filter substrate is sucked onto the hot plate. In a case (2) of the cooling by means of a cool plate, when the lift pin is lowered, the color filter substrate is placed on the cool plate and is sucked and the head part of the lift pin is located on a position lower than the upper surface of the cool plate, air sucking is started such that the color filter substrate is sucked onto the cool plate. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006284667(A) 申请公布日期 2006.10.19
申请号 JP20050101215 申请日期 2005.03.31
申请人 TOPPAN PRINTING CO LTD 发明人 TATSUKAWA HIROSHI;FUJIKAKE RYOSUKE;SAKAGUCHI YOICHI
分类号 G02B5/20;G02F1/13;G02F1/1333;G02F1/1335;G03F7/38 主分类号 G02B5/20
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