| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component, which is capable of enhancing the mounting efficiency by eliminating wasteful time and shortening tact time. <P>SOLUTION: In the method for mounting the electronic component, in which the electronic component is picked up and mounted to a substrate by a transfer head, equipped with a plurality of suction nozzles 11 which are raised and lowered by an air cylinder. At the rising movement of the transfer head in the picking up process and the mounting process of the electronic component, the rising movement of the air cylinder, in which the suction nozzle 11 is raised, is performed together with Z-axis rising movement, in which the transfer head is raised and lowered. Thus, the suction nozzle 11 is raised. Horizontal movement of the transfer head is started at a timing that the suction nozzle 11 in the middle of rising attains an interference avoidance height Hn, in which the interference with a mounted component P1 can be cleared. Thereby, wasteful time in which the transfer head waits is eliminated, and tact time can be shortened. <P>COPYRIGHT: (C)2007,JPO&INPIT |
