Etching process having plasma pre-treatment for inducing carbon contained fluorine free - polymer on photoresist patterns,申请号KR20030044543-传众专利搜索

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发明名称	Etching process having plasma pre-treatment for inducing carbon contained fluorine free - polymer on photoresist patterns
摘要
申请公布号	KR100630677(B1)	申请公布日期	2006.10.02
申请号	KR20030044543	申请日期	2003.07.02
申请人		发明人
分类号	H01L21/3065;G03F7/36;G03F7/40;H01L21/027;H01L21/311	主分类号	H01L21/3065
代理机构		代理人
主权项
地址

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