METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING IMPRINTING PROCESS

摘要

A method of manufacturing a printed circuit board using an imprinting process is provided to form a uniform circuit pattern in the following process by forming a groove of a circuit pattern on an insulation layer. Plural molds(201-209) and a base substrate(110) having an insulation layer(120) are aligned. The molds are transferred onto the insulation layer. The insulation layer is cured. The molds are detached from the insulation layer to form a groove of a circuit pattern on the insulation layer. An electroless plated layer is formed in the groove of the circuit pattern and the insulation layer. An electrolytically plated layer is formed on the electroless plated layer. The plated layers are polished until the insulation layer is exposed.