SWITCH ARRAY

摘要

A first wiring layer (16) is provided on an insulation film (14) on the lower face of an upper substrate (15), a second wiring layer (13) crossing the first wiring layer (16) in a three-dimensional manner is provided on an insulation film (12) on a lower substrate (11), one end of a cantilever (17) is connected to the first wiring layer (16), and the other end of the cantilever (17) is positioned to face the second insulation layer (13) with a space in between. A thermoplastic sheet (19) is placed on the upper substrate (15) so as to cover a through-hole (18), and the thermoplastic sheet (19) is pressed against the cantilever (17) by a heated pin (20) to deform the thermoplastic sheet (19), thereby a switch (10) is closed with the connection of the cantilever (17) to the second wiring layer (13) maintained.