| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable silicone composition that exhibits excellent handling workability and curability and is cured to form a cured product excellent in flexibility and adhesive properties, and an electronic part exhibiting excellent reliability. <P>SOLUTION: The curable silicone composition comprises at least (A) a diorganopolysiloxane represented by the general formula: A-R<SP>2</SP>-(R<SP>1</SP><SB>2</SB>SiO)<SB>n</SB>R<SP>1</SP><SB>2</SB>Si-R<SP>2</SP>-A äwherein R<SP>1</SP>is, the same or different, a substituted or unsubstituted monovalent hydrocarbon group having no aliphatic unsaturated bond; R<SP>2</SP>is a bivalent organic group; A is a siloxane residue represented by an average unit formula: (XR<SP>1</SP><SB>2</SB>SiO<SB>1/2</SB>)<SB>a</SB>(SiO<SB>4/2</SB>)<SB>b</SB>(wherein R<SP>1</SP>is the same group as above; X is a single bond, a hydrogen atom, a group represented by R<SP>1</SP>above, an epoxy group-bearing alkyl group or an alkoxysilylalkyl group, provided that at least one X is a single bond and at least two Xs are each the epoxy group-bearing alkyl group in one molecule; a is a positive number; b is a positive number; and a/b is a positive number of 0.2-4); and n is an integer of at least 1}, and (B) a curing agent for epoxy resins. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
