| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for controlling a stage position wherein the drawing accuracy can be enhanced. SOLUTION: A charged particle applied device is so designed that a wafer 5 placed on a sample stage 6 is irradiated with a charged particle beam. This device is so constructed that it includes a position correction amount detecting means 13 that detects the position of the sample stage 6, and detects an amount of correction for position variation; a D/A converter that converts position correction signals as the output of the position correction amount detecting means into analog signals; an adding means that adds the output of the D/A converter to a control signal for deflection in a source of radiation; a deglitcher circuit that removes glitch noise; and a timing adjusting means 11 that is capable of adjusting the timing of addition of a deflection control signal and a position correction signal with the deglitcher circuit in operation. COPYRIGHT: (C)2006,JPO&NCIPI
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