发明名称 Method for forming an SOI structure with improved carrier mobility and ESD protection
摘要 A semiconductor device and method for forming the same including improved electrostatic discharge protection for advanced semiconductor devices, the semiconductor device including providing semiconductor substrate having a pre-selected surface orientation and crystal direction; an insulator layer overlying the semiconductor substrate; a first semiconductor active region overlying the insulator layer having a first surface orientation selected from the group consisting of <100> and <110>; a second semiconductor active region extending through a thickness portion of the insulator layer having a second surface orientation selected from the group consisting of <110> and <100> different from the first surface orientation; wherein MOS devices including a first MOS device of a first conduction type is disposed on the first semiconductor active region and a second MOS device of a second conduction type is disposed on the second semiconductor active region.
申请公布号 US2006214226(A1) 申请公布日期 2006.09.28
申请号 US20050089405 申请日期 2005.03.23
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 CHEN HUNG-WEI;TSAO HSUN-CHIH;CHEN KUANG-HSIN;LEE DI-HONG
分类号 H01L29/04;H01L21/84 主分类号 H01L29/04
代理机构 代理人
主权项
地址