发明名称 SURFACE ACOUSTIC WAVE DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a surface acoustic wave device, having a structure where an insulating layer is formed to cover an IDT electrode, having a fully large reflection coefficient for IDT, and is capable of suppressing deterioration in characteristics due to undesired ripples. <P>SOLUTION: In the surface acoustic wave device, a first insulating layer 2 is formed over the whole surface of a LiTaO<SB>3</SB>substrate as a piezoelectric substrate. The first insulating layer, at a part where an IDT electrode is formed, is removed by using a resist pattern 3 for forming the IDT electrode. An electrode film, made of a metal having a density higher than that of Al or of an alloy consisting essentially of the metal, is formed in a region where the first insulating electrode layer is removed so as to form an IDT electrode 4A. The resist, remaining on the first insulating layer, is removed. A second insulating layer 6 is formed so as to cover the first insulating layer 2 and the IDT electrode 4A. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006254507(A) 申请公布日期 2006.09.21
申请号 JP20060161348 申请日期 2006.06.09
申请人 MURATA MFG CO LTD 发明人 KADOTA MICHIO;NAKAO TAKESHI;NISHIYAMA KENJI
分类号 H03H9/145;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H03H3/08;H03H9/25 主分类号 H03H9/145
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