发明名称 Finfet-type semiconductor device and method for fabricating the same
摘要 A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench and contains an impurity of the same conductive type; a semiconductor FIN buried in the trench and provided between the source and drain regions; a gate insulating film provided on a side surface of the semiconductor FIN as well as the upper surface of the semiconductor FIN; and a gate electrode formed on the gate insulating film.
申请公布号 US2006208300(A1) 申请公布日期 2006.09.21
申请号 US20050549291 申请日期 2005.09.14
申请人 IWANAGA JUNKO;TAKAGI TAKESHI;KANZAWA YOSHIHIKO;SORADA HARUYUKI;SAITOH TOHRU;KAWASHIMA TAKAHIRO 发明人 IWANAGA JUNKO;TAKAGI TAKESHI;KANZAWA YOSHIHIKO;SORADA HARUYUKI;SAITOH TOHRU;KAWASHIMA TAKAHIRO
分类号 H01L27/108;H01L21/336;H01L29/423;H01L29/786 主分类号 H01L27/108
代理机构 代理人
主权项
地址
您可能感兴趣的专利