发明名称 Method of forming capacitor over bitline contact
摘要 A method of forming a contact for a semiconductor device by forming a storage node contact in a semiconductor substrate having a first pad and a second pad formed thereon. The storage node contact is connected to the second pad. A bit line electrically insulated from the storage node contact by a spacer and electrically connected to the first pad.
申请公布号 US7109080(B2) 申请公布日期 2006.09.19
申请号 US20050033447 申请日期 2005.01.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE YONG-WOO;PARK JONG-CHUL;KWON O-IK;JEONG SANG-SUP
分类号 H01L21/28;H01L21/8242;H01L21/3205;H01L21/4763 主分类号 H01L21/28
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