发明名称 POSITIVE RESIST COMPOSITION FOR LIQUID IMMERSION EXPOSURE AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resist which shows little deterioration in the sensitivity when applied to liquid immersion exposure compared to dry exposure and causes extremely little elution of an acid into an immersion liquid, and which is suitable for liquid immersion exposure. <P>SOLUTION: The positive resist composition for liquid immersion exposure contains (A) a resin the solubility of which with an alkali developing solution is increased by an effect of an acid, and (B) a compound which generates an acid by irradiation with active rays or radiation. When the composition is applied to form a coating film on a substrate, the composition exhibits a static contact angle of &ge;72&deg; to pure water and a static contact angle of &le;70&deg; to an alkali developing solution. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006243264(A) 申请公布日期 2006.09.14
申请号 JP20050057634 申请日期 2005.03.02
申请人 FUJI PHOTO FILM CO LTD 发明人 INABE HARUKI;KANNA SHINICHI;KANDA HIROMI
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址