| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package structure which is made small in size and low in profile and is suitable for packaging a surface acoustic wave element piece. <P>SOLUTION: The package structure of the surface acoustic wave device is provided with: a base 16 equipped with a thick bottom part 16b where a surface acoustic wave element piece 12 is arranged; and a thin bottom part 16a where an electronic component 14 is arranged, wherein the mounting positions of the surface acoustic wave element piece and the electronic component are made adjacent in a plane coordinate system. In the package structure, the height difference of the thin bottom part 16a and the thick bottom part 16b may be preferentially at least the thickness of the electronic component 14 mounted on the thin bottom part 16a. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
