发明名称 Semiconductor molding temperature and pressure sensors
摘要 The present invention provides a sensing device for monitoring temperature and sensor in a semiconductor mold. The sensing device comprises a first and second optical fiber attached therein. A first Bragg grating (FBG) sensor is fabricated in the first optical fiber to measure the pressure parameter of the molten molding material in the mold. A second FBG sensor is fabricated in the second optical fiber to measure the temperature parameter of the molten molding material in the mold.
申请公布号 US2006182832(A1) 申请公布日期 2006.08.17
申请号 US20060356103 申请日期 2006.02.17
申请人 SIF UNIVERSAL PTE LTD 发明人 HO BOON K.
分类号 B29C35/12 主分类号 B29C35/12
代理机构 代理人
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