| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To lower occurrence of leak between adjacent bumps or electrodes by lowering the density of conductive particles in a bump forming region. <P>SOLUTION: On the entire circuit forming surface 9 in the substrate 8 of a driving IC chip 7, a nonconducting adhesive material 13 not containing conductive particles is arranged to cover a bump 10, and a conducting adhesive material 14 containing conductive particles 14a is arranged on the nonconducting adhesive material 13 in the bump forming region 11 on the circuit forming surface 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
