发明名称 |
Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles |
摘要 |
Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is terminated at a second bond site with the bonding tool, thereby creating a wire bond profile. The technique is repeated for a plurality of additional wire bonds of the integrated circuit, and at least two wire bond profiles in the integrated circuit are substantially perpendicular to one another at a crossing point of the profiles.
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申请公布号 |
US2006172524(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20060395779 |
申请日期 |
2006.03.31 |
申请人 |
MILLER CURTIS J;TRONCOSO NELSON |
发明人 |
MILLER CURTIS J.;TRONCOSO NELSON |
分类号 |
H01L21/44;H01L21/60;H01L23/66 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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