| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging method of a semiconductor chip suitable for mass production of semiconductor chip at low cost by shortening the mounting time of the semiconductor chip on a wiring circuit board, and to provide a structure of a wiring circuit board, and a process for producing a wiring circuit board. SOLUTION: In the packaging method of a semiconductor chip for mounting a semiconductor chip on a wiring circuit board by flip-chip system, the semiconductor chip held separably on the surface of a film is pushed by an ultrasonic horn from the back side of the film and projected. While being loaded with vibration by ultrasonic wave from the ultrasonic horn, the projected semiconductor chip is pressed against a wiring circuit board corresponding to the same pressing direction thus stripping the semiconductor chip and, at the same time, bonding the electrode of the semiconductor chip to the circuit of the wiring circuit board. COPYRIGHT: (C)2006,JPO&NCIPI
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