| 摘要 |
PROBLEM TO BE SOLVED: To improve the quality of an insulative coated molding and productivity in an insulative coating formation process in a process that beforehand forms an insulative coating on a defective element electrode so as not to allow other elements to be affected by the defective element such that a power supply line and an eathing line are short-circuited. SOLUTION: A U.V. resin 9 can be centrally dropped in the specific region of an electrode 5 by slating a nozzle spraying the resin 9 at 45°when the insulative coating is formed on the electrode 5 of the semiconductor device, and the dropping direction of the resin 9 can be determined in a direction of the same condition even if the electrode 5 is located at any position on the semiconductor device by providing a rolling mechanism to the nozzle 7, thus, this allows the dropping condition to be easily determined together with the nozzle 7, thereby enabling the system to improve the quality of the insulative coated molding. COPYRIGHT: (C)2006,JPO&NCIPI
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