| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of dispensing with separate provision of an external terminal and of reducing the number of components and the number of assembling processes. SOLUTION: Semiconductor chips 2, 3 are accommodated in an accommodation space formed with an upper casing 4 and a lower casing 5. The upper casing 4 is formed by insert molding an electrode plate 41 with insulating resin, and a frame member 42 and the electrode plate 41 are integrated. In the same fashion, the lower casing 5 is also formed by insert molding an electrode plate 51 with insulating resin, and a frame member 52 and the electrode plate 51 are integrated. A module 1 is formed by soldering the semiconductor chips 2, 3 onto the electrode plate 51, placing contact electrodes 8 on the semiconductor chips 2, 3 respectively, covering the lower casing 5 with the upper casing 4, and joining the frame members 42, 52 using an adhesive or the like while pressurizing the electrode plates 41, 51 from upper and lower. COPYRIGHT: (C)2006,JPO&NCIPI |
