| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit structure in which heat dissipation can be enhanced by absorbing heat generated from a switching device through a second bus bar opposing the switching device mounted on a control circuit board. <P>SOLUTION: A branch portion 12 and a power supply distributing portion 13 are combined entirely into substantially L-shape while butting the edges each other to produce a circuit body 11 which is then surrounded by a casing 15 thus obtaining an electric connection box 10. A second bus bar 35 is wired in on the surface of the power supply distributing portion 13. The second bus bar is provided with a screen 35C perpendicular to the surface of the power supply distributing portion 13, and the screen 35C is arranged on the drain terminal side of a switching device 34 oppositely to the most heat generating region thereof. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
