发明名称 HEAT SINK AND COMPONENT SUPPORT ASSEMBLY
摘要 <p>A heat sink and component support assembly that includes a core structure (110). The core structure (110) includes: a central member (112) having first (114, 116) and second opposing sides; at least one heat dissipating surface (124, 126, 128) extending from at least one of the first opposing sides (114, 116); and first and second extension members (118, 120) positioned adjacent to each of the second opposing sides. The assembly may also include an airflow facilitating arrangement, such as a fan (184), positioned adjacent to the core structure (110) for further enhanced heat dissipating capabilities.</p>
申请公布号 WO2006071500(A2) 申请公布日期 2006.07.06
申请号 WO2005US44851 申请日期 2005.12.13
申请人 MOTOROLA, INC.;WIDMAYER, ROBERT, B.;TUROCY, JAMES, W.;WALTER, PETER, P. 发明人 WIDMAYER, ROBERT, B.;TUROCY, JAMES, W.;WALTER, PETER, P.
分类号 H05K7/20 主分类号 H05K7/20
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