PLASTIC CONDUCTIVE PARTICLES AND MANUFACTURING METHOD THEREOF

摘要

This invention relates to plastic conductive particles having an outer diameter of 2.5 µm~l mm obtained by sequentially plating a 0.1-10 W thick a metal plating layer and a 1-100 W thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and to a method of manufacturing thereof . The method of manufacturing the plastic conductive particles according to this invention includes preparing plastic core beads having excellent thermal properties and a high elastic modulus of compression, etching surfaces of the plastic core beads for surface treatment thereof, forming a metal plating layer via electroless plating to improve adhesion between the bead surface and the metal plating layer, and then forming a solder layer in a manner such that a sealed hexagonal barrel is immersed in an electroplating solution and then an electroplating process is conducted using a mesh barrel rotating 360 °at 6~10 rpm or a mesh barrel having a structure in which one surface of a conventional sealed hexagonal barrel is open, and rotating 200° in right and left directions at 1~5 rpm, to manufacture plastic conductive particles having a size of 1 mm or less. The plastic conductive particles of this invention enable the maintenance of packaging gaps, and thus can be applied to IC packaging, LCD packaging and other conductive materials.