发明名称 |
BGA PACKAGE HAVING A BONDING PAD BECOME HALF ETCHING AND CUT PLATING GOLD LINES AND MANUFACTURING METHOD THEREOF |
摘要 |
A ball grid array (BGA) package having a half-etched bonding pad and a cut plating line and a method of fabricating the same. In the BGA package, the plating line is cut to form a predetermined uneven bonding pad using half-etching, thereby increasing the contact area between the bonding pad and a solder ball. The BGA package includes a first external layer having a first circuit pattern and a wire bonding pad pattern wherein a chip is connected to a wire bonding pad using wire bonding. A second external layer includes a second circuit pattern, a cut plating line pattern, and a half-etched uneven solder ball pad pattern. In the second external layer, another chip is mounted on a solder ball pad. An insulating layer having a through hole interposed between the first and second external layers and electrically connects the first and second external layers therethrough. |
申请公布号 |
KR20060078110(A) |
申请公布日期 |
2006.07.05 |
申请号 |
KR20040116799 |
申请日期 |
2004.12.30 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, HYO SOO;PARK, SUNG EUN |
分类号 |
H01L21/60;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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