发明名称 |
Polybenzoxazoles from poly-o-hydroxyamide, novel poly-o-hydroxyamides, preparation processes therefor, and their application in microelectronics |
摘要 |
High-temperature-stable polybenzoxazoles are formed from novel poly-o-hydroxyamides. The novel poly-o-hydroxyamides have low dielectric constants, are suitable for exposure at 248 nm or shorter wavelengths, and have hydroxyl groups at least some of which have been protected by tert-butoxycarbonyl protective groups.
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申请公布号 |
US7070904(B2) |
申请公布日期 |
2006.07.04 |
申请号 |
US20020244802 |
申请日期 |
2002.09.16 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
SEZI RECAI |
分类号 |
G03F7/004;C08G73/00;C08G73/22;G03F7/039 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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