| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce involved voids by restraining the variation of the height of a solder bump, to improve packaging yield of semiconductor elements such as ICs onto a packaging pad, and further to improve packaging reliability and heat cycle resistance. <P>SOLUTION: The opening of a printing mask is formed larger than that of a solder resist layer, and they are placed while shifting by a predetermined amount the center of the opening of the printing mask and the center of the opening of the solder resist layer or they are opened. Simultaneously, in a state where they are opened such that the large exposure of the solder resist layer is produced at any position in these openings, a solder paste is filled from the opening of the printing mask and is printed on the packaging pad. Thereafter, a solder bump is formed by reflow processing. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
