发明名称 PROCESSING UNIT AND PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a processing unit equipped with high fixed throughput despite of small footprint and low cost. SOLUTION: A washing processing unit 100 which is one embodiment of a processing unit comprises a career placing part 1 for placing a career C wherein wafers are accommodated, a chamber 21 for washing processing of the wafers, and a wafer conveyance 3 for conveying the wafers between a career placing part 1 and the chamber 21. The wafer conveyance 3 is provided with holders 32a and 32b for carrying out/in collectively two or more wafers to the chamber 21, conveyance picks 34a and 34b for conveying wafers one by one, and a robot 31 which can be freely engaged/removed respectively from the conveyance picks 34a and 34b and the holders 32a and 32b, and accessible to the carrier C and the chamber 21. The robot 31 exchanges the conveyance picks 34a and 34b with the holders 32a and 32b so as to convey wafers between the career C and the chamber 21. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006173193(A) 申请公布日期 2006.06.29
申请号 JP20040360257 申请日期 2004.12.13
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI;EGASHIRA KOJI
分类号 H01L21/677;H01L21/02;H01L21/304;H01L21/306 主分类号 H01L21/677
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