发明名称 Method for making a semiconductor device having a high-k gate dielectric and a titanium carbide gate electrode
摘要 A method for making a titanium carbide layer is described. That method comprises alternately introducing a carbon containing precursor and a titanium containing precursor into a chemical vapor deposition reactor, while a substrate is maintained at a selected temperature. The reactor is operated for a sufficient time, and pulse times are selected for the carbon containing precursor and the titanium containing precursor, to form a titanium carbide layer of a desired thickness and workfunction on the substrate.
申请公布号 US7064066(B1) 申请公布日期 2006.06.20
申请号 US20040006074 申请日期 2004.12.07
申请人 INTEL CORPORATION 发明人 METZ MATTHEW V.;DATTA SUMAN;DOCZY MARK L.;KAVALIEROS JACK;BRASK JUSTIN K.;CHAU ROBERT S.
分类号 H01L21/44 主分类号 H01L21/44
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