发明名称 |
Airdome enclosure for components |
摘要 |
A component having an airdome enclosure that protects the component from its external environment. An airdome enclosure according to the present techniques avoids the high costs of employing special materials and/or specialized process steps in the manufacture of a component. An electronic component according to the present techniques includes a set of substructures formed on a substrate and an airdome enclosure over the substructures that protects the substructures and that hinders the formation of parasitic capacitances among the substructures. |
申请公布号 |
US2006121686(A1) |
申请公布日期 |
2006.06.08 |
申请号 |
US20060337352 |
申请日期 |
2006.01.23 |
申请人 |
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发明人 |
WEI JOHN SHI S.;PARKHURST RAY M.;JENNISON MICHAEL J.;NIKKEL PHILIP G. |
分类号 |
H01L21/76;H01L21/44;H01L21/4763;H01L21/48;H01L21/50;H01L23/31;H01L23/522 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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