ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT

摘要

An electronic component production method for producing an electronic component (5) having a base circuit sheet bonded with an interposer (50) comprising a base circuit forming step for forming a base side terminal on a continuous sheet-like continuous base member (610), an arranging/bonding step for arranging the interposer (50) on the surface of the continuous base member (610) on which the base side terminal is formed and bonding the interposer (50) in place, and a separating step for cutting out the electronic component (5) from the continuous base member (610) bonded with the interposer (50). In the electronic component production method, respective steps are repeated in parallel while advancing the common continuous base member (610).