| 摘要 |
PROBLEM TO BE SOLVED: To provide a printing method of a ceramic green sheet with which regulation of physical property of conductive paste is relieved and a wiring pattern and a via hole can simultaneously and securely be printed by using a mesh mask, and to provide a method of manufacturing a ceramic multilayer wiring board. SOLUTION: In the method, via hole filling printing for filling the via hole 17 with conductive paste P is performed on the ceramic green sheet 4' having the via hole 17, and wiring pattern printing for forming the wiring pattern with conductive paste P on a surface of the ceramic green sheet 4' is simultaneously performed. The mesh mask 11 where a wiring pattern printing hole 15 and a via hole filling printing hole 16 larger than the via hole 17 are made is arranged on the ceramic green sheet 4', so that a peripheral edge of orthogonal projection of the via hole filling printing hole 16 onto the surface of the ceramic green sheet 4' surrounds the via hole 17 of the ceramic green sheet 4'. Conductive paste P is supplied onto the mesh mask 11, and via hole filling printing and wiring pattern printing are simultaneously performed on the ceramic green sheet 4'. COPYRIGHT: (C)2006,JPO&NCIPI |
