| 摘要 |
An optical package structure ( 2 ) includes a cover ( 21 ) defining an aperture ( 212 ) in a top portion for transmission of optical signals, a lens part ( 22 ) secured to the cover, and a base member ( 23 ) combining with the cover to define a closed space in which to package optical components. A plurality of solder pads ( 2311-2314, 2391-2394, 2391', 2392' ) is provided on both a top and a bottom surfaces ( 2321, 2342 ) of the base member, and a plurality of inner conductive traces ( 236, 239 ) extends through the base member and provides an electrical connection of the solder pads on the top surface to the solder pads on the bottom surface. All the solder pads on the top surface are connected to a complementary solder pad located along a first side edge of the bottom surface, and at least one of the solder pads on the top surface is electrically connected to one of the solder pads on the bottom surface which is not located along the first side edge. |
