| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for plating a substrate where, in a process of closely and uniformly plating fine cavities such as fine grooves for wiring formed on a substrate with copper, a copper alloy or the like, the abnormal rising phenomenon (over plate) of a plating film as the harmful effect of bottom up film deposition (preferential growth from trench or via bottoms) can be suppressed. SOLUTION: In the plating method for a substrate where metal is filled into fine cavities on a substrate W, after first plating treatment is performed in a plating liquid with a plating accelerator added thereto, a plating accelerator removing treatment where the surface to be plated is brought into contact with a removal agent for removing or reducing the plating accelerator stuck to the surface to be plated is performed, and further, second plating treatment is performed. COPYRIGHT: (C)2006,JPO&NCIPI
|
