| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation efficiency easily while using a timber for an outer package of an electronic apparatus. SOLUTION: A top cover 1 which makes a part of an outer package covering a heating part, such as various electric/electronic circuits, a light source, etc. is constituted of a compression timber compressively molded by a mold. Uneven parts 1A and 1B for heat dissipation to the external surface side of the top cover 1 are integrally molded by the mold. COPYRIGHT: (C)2006,JPO&NCIPI
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