| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit device wherein the bonding strength between an electrically conductive pattern 11 and a sealing resin 13 is improved, and to provide a manufacturing method thereof. <P>SOLUTION: The circuit device 10A in the present mode comprises the electrically conductive pattern 11 where holes 18 are provided; a semiconductor element 12A electrically connected to this conductive pattern 11; and the sealing resin 13 for covering the semiconductor device 12A and the conductive pattern 11 and exposing the underside of the conductive pattern 11. The adhesion strength between the conductive pattern 11 and the sealing resin 13 is improved by filling the holes 18 provided in the conductive pattern 11 with the sealing resin 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
