| 摘要 |
A method for manufacturing an electronic device, in which a via hole and a trench for an interconnect are integrally provided in an interlayer insulating film formed on a substrate, and the via hole and the trench for the interconnect are plugged with an electric conductor film is provided. The method includes: forming a via hole in the interlayer insulating film; forming a resin film, plugging the via hole, on the interlayer insulating film; forming a resist mask having an opening for an interconnect on the interlayer insulating film; and etching the interlayer insulating film through an etching mask of the resist mask to form a trench for the interconnect connected with the via hole. The resin film is being capable of trapping a basic substance.
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