| 摘要 |
A semiconductor device includes a base region formed above a semiconductor substrate, a source region formed above the base region, a gate electrode filled inside a trench formed above the semiconductor substrate, an interlayer insulation film formed all over the semiconductor substrate, a first contact hole formed in the interlayer insulation film to expose the gate electrode, a second contact hole formed in the interlayer insulation film and the source region to expose the base region, and a conductive film formed above a trench where the first contact hole is formed.
|
