发明名称 |
Verfahren zum Herstellen eines Flachleiterrahmens mit verbesserter Haftung zwischen diesem und Kunststoff sowie Flachleiterrahmen |
摘要 |
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands. |
申请公布号 |
DE10348715(B4) |
申请公布日期 |
2006.05.04 |
申请号 |
DE2003148715 |
申请日期 |
2003.10.16 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
DANGELMAIER, JOCHEN;PAULUS, STEFAN;BETZ, BERND |
分类号 |
H01L23/50;H01L21/48;H01L21/56;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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