发明名称 |
Method for fabricating semiconductor device with fine patterns |
摘要 |
The present invention relates to a method for fabricating a semiconductor device with realizable advanced fine patterns. The method includes the steps of: forming a hard mask insulation layer on an etch target layer; forming a hard mask sacrificial layer on the hard mask insulation layer; coating a photoresist on the hard mask insulation layer; performing selectively a photo-exposure process and a developing process to form a photoresist pattern having a first width for forming a line pattern; etching selectively the hard mask sacrificial layer by using the photoresist pattern as an etch mask to form a sacrificial hard mask having a second width; removing the photoresist pattern; etching the hard mask insulation layer by controlling excessive etching conditions with use of the sacrificial hard mask as an etch mask to form a hard mask having a third width; and etching the etch target layer by using the sacrificial hard mask and the hard mask as an etch mask to form the line pattern having a fourth width, wherein the first width is wider than the fourth width.
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申请公布号 |
US7037850(B2) |
申请公布日期 |
2006.05.02 |
申请号 |
US20030728775 |
申请日期 |
2003.12.08 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE SUNG-KWON;KIM SANG-IK;LEE MIN-SUK |
分类号 |
H01L21/302;H01L21/308;H01L21/3213;H01L21/461;H01L27/108 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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