发明名称 |
THIN FILM FORMING APPARATUS AND METHOD THEREOF |
摘要 |
A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for holding the target material, a placing means for placing a substrate to be deposited with the sputtered target material and a carrying mechanism for the placing means. In the carrying mechanism, a carrying path is provided so as to permit the substrate pass through the front side of the target material, and the placing means is composed of a substrate tray which can hold a plurality of substrates in juncture. |
申请公布号 |
WO2006043343(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
WO2005JP00853 |
申请日期 |
2005.01.24 |
申请人 |
SHOWA SHINKU CO., LTD.;FUJIWARA, TAKAYUKI;NAGAI, KAZUYOSHI |
发明人 |
FUJIWARA, TAKAYUKI;NAGAI, KAZUYOSHI |
分类号 |
C23C14/34;H01L41/09;H01L41/18;H01L41/22;H01L41/29;H03H3/02 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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