FUNCTIONAL ELEMENT PACKAGE, MANUFACTURING METHOD THEREOF, CIRCUIT MODULE HAVING FUNCTIONAL ELEMENT PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce the size and thickness by providing a sealing structure for a functional element body. SOLUTION: A package substrate 11 where a functional element body 12 having a very small movable part on the functional surface is packaged and a thin multi-layer circuit body 14 where the peripheral circuit of the functional element body 12 is constructed are joined to each other through a bonding resin frame body 13 to constitute a hollow part 15 for sealing the functional element body 12. COPYRIGHT: (C)2006,JPO&NCIPI