发明名称 METHOD AND APPARATUS FOR MANUFACTURING POLYIMIDE COMPOUND FILM
摘要 PROBLEM TO BE SOLVED: To manufacture a polyimide compound film uniform in thickness by controlling the film thickness distribution in the width direction of the film in a film forming method of a polyimide compound. SOLUTION: In the manufacturing method of the polyimide compound film wherein a solution of a resin selected from the group consisting of the polyimide compound and its precursor is supplied to be laterally expanded and cast to form the polyimide compound film, the viscosity of the solution is adjusted in a supply passage for supplying the solution to the die and, after the viscosity of the solution is adjusted, it is measured before a polyimide compound varnish is introduced into an extrusion die to be adjusted so as to become constant. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006103289(A) 申请公布日期 2006.04.20
申请号 JP20040296900 申请日期 2004.10.08
申请人 KANEKA CORP 发明人 UEJIMA KENJI
分类号 B29C47/14;B29C41/24;B29C41/32;B29K77/00;B29L7/00;C08G73/10;C08J5/18;C08L79/08 主分类号 B29C47/14
代理机构 代理人
主权项
地址