| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition high in adhesive strength to lead frame and excellent in reliability after undergoing soldering treatment, and to provide a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing use comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing promoter, (D) an inorganic filler, (E) a compound having a triazine thiol structure and represented by the general formula(1) and (F) an aromatic carboxylic acid. The semiconductor device obtained by sealing semiconductor elements with this resin composition is also provided. COPYRIGHT: (C)2006,JPO&NCIPI
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