| 摘要 |
A cushioning material according to the present invention comprises a cushioning layer and a surface layer comprising a non-thermoplastic polyimide film which is integrally bonded onto the cushioning layer without a bonding agent layer. The non-thermoplastic polyimide film is provided by heating a polyamic acid film integrally bonded onto the cushioning layer without a bonding agent and thereby imidating the polyamic acid.
|
