| 摘要 |
A hybrid-buckling beam probe assembly is disclosed for probing semiconductor chips. The probe assembly includes an upper and lower die. A template is attached to a boss on the lower die. This template improves the reliability, time, and cost of assembling the hybrid-buckling beam probe assembly. In addition, the template facilitates on site repair and replacement of hybrid buckling beam probes that become damaged or worn during use. An optional spacer may be attached between the upper and lower dies. A template alignment tool is used to attach the template to the boss by means of adhesive strips.
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