发明名称 |
Method and apparatus for cutting semiconductor wafers |
摘要 |
Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
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申请公布号 |
US7018270(B2) |
申请公布日期 |
2006.03.28 |
申请号 |
US20050191795 |
申请日期 |
2005.07.28 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
PENG NEO CHEE;CHUAN TAN HOCK;SENG HO KIAN;CHYE CHEW BENG;HAR LIM GUEK;CHUA TAN KOK |
分类号 |
B24B1/00;B23D59/00;B24B49/00;B24B51/00;B28D1/02;B28D1/32;B28D5/02;H01L21/301;H01L21/304;H01L21/44;H01L21/46;H01L21/78 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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