| 发明名称 |
A mold |
| 摘要 |
A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use. |
| 申请公布号 |
SG120071(A1) |
申请公布日期 |
2006.03.28 |
| 申请号 |
SG20020004123 |
申请日期 |
2002.07.05 |
| 申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
HO SHU CHUEN;KUAH TENG HOCK;HUI MAN HO;NARASIMALU SRIKANTH;SARANGAPANI MURALI |
| 分类号 |
H01L21/56;(IPC1-7):H01L21/58;B29C45/14 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
