| 摘要 |
A heat dissipation device includes a first heat sink ( 10 ) mounted on one side of a video graphics adapter (VGA) card ( 70 ) on which a heat generating componnent ( 74 ) is mounted to dissipate heat generated by the heat generating componnent, a second heat sink ( 30 ) mounted on an opposite side of the card, a first heat pipe ( 50, 50 ') thermally connected to the first heat sink, a second heat pipe ( 60, 60 ') discrete from the first heat pipe thermally connected to the second heat sink, and a connecting member ( 80, 80 ') connected between the first and second heat pipes for transferring heat from the first heat pipe to the second heat pipe.
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