<p>An aluminum-silicon carbide composite suitably used as the base plate of a ceramic circuit board for mounting a semiconductor component requiring high reliability. An aluminum-silicon carbide composite comprising a flat silicon carbide porous element impregnated with a metal mainly containing aluminum and having an aluminum layer consisting of a metal mainly containing aluminum on each of its opposite main surfaces, one main surface being joined to a circuit board and the other main surface being used as a radiation surface, characterized in that the radiation surface of the silicon carbide porous element is formed or machined into a convexly warped shape and is impregnated with a metal mainly containing aluminum, and then the aluminum layer on the radiation surface is further machined to form a warp.</p>
